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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MPX2010/D
10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors
The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors provide a very ac c ur at e and l i n e a r v o l ta g e o u tp u t -- d i r ec tl y proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin-film resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Features * Temperature Compensated over 0C to +85C * Ratiometric to Supply Voltage * Differential and Gauge Options Application Examples * Respiratory Diagnostics * Air Movement Control * Controllers * Pressure Switching Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 GND
UNIBODY PACKAGE
MPX2010 MPXV2010G SERIES
Motorola Preferred Device
MPX2010D CASE 344
COMPENSATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) FULL SCALE SPAN: 25 mV
SMALL OUTLINE PACKAGE SURFACE MOUNT
MPX2010GP CASE 344B
MPXV2010GP CASE 1369
2 4
SENSING ELEMENT
Vout+ Vout-
MPX2010DP CASE 344C
MPXV2010DP CASE 1351
PIN NUMBER
1 2 MPX2010GS CASE 344E 3 4 Gnd +Vout VS -Vout 5 6 7 8 N/C N/C N/C N/C
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1).
NOTE: Pin 1 is noted by the notch in the lead.
MPX2010GSX CASE 344F
PIN NUMBER
Preferred devices are Motorola recommended choices for future use and best overall value.
1 2
Gnd +Vout
3 4
VS -Vout
REV 9
NOTE: Pin 1 is noted by the notch in the lead.
Motorola Sensor Device Data (c) Motorola, Inc. 2002
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MPX2010 MPXV2010G SERIES
MAXIMUM RATINGS(NOTE)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 75 -40 to +125 -40 to +125 Unit kPa C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Supply Range(1) Symbol POP VS Io VFSS Voff V/P -- (0 to 10 kPa) (-40C to +125C) Span(5) -- -- TCVFSS TCVoff Zin Zout (10% to 90%) tR -- -- Min 0 -- -- 24 -1.0 -- -1.0 -- -- -1.0 -1.0 1000 1400 -- -- -- Typ -- 10 6.0 25 -- 2.5 -- 0.1 0.5 -- -- -- -- 1.0 20 0.5 Max 10 16 -- 26 1.0 -- 1.0 -- -- 1.0 1.0 2550 3000 -- -- -- Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV ms ms %VFSS
Voltage(2)
Supply Current Full Scale Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) Span(3)
Temperature
Hysteresis(5)
Temperature Effect on Full Scale Temperature Effect on Offset(5) Input Impedance Output Impedance Response Warm-Up Offset Stability(7) Time(6)
NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
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Motorola Sensor Device Data
MPX2010 MPXV2010G SERIES ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
VS = 10 Vdc TA = 25C P1 > P2
aMAX
30 OUTPUT (mVdc) 25 20 15 10 5 0 -5 kPa PSI
TYP
SPAN RANGE (TYP) MIN
2.5 0.362
5 0.725
7.5 1.09
10 1.45
OFFSET (TYP)
Figure 2. Output versus Pressure Differential
Figure 2 shows the output characteristics of the MPX2010/MPXV2010G series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics.
This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation.
SILICONE DIE COAT WIRE BOND
STAINLESS STEEL METAL COVER DIE P1 EPOXY CASE
LEAD FRAME
Figure 3. Unibody Package -- Cross-Sectional Diagram (not to scale)
Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010/MPXV2010G series pressure sensor oper-
Motorola Sensor Device Data
EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE
P2
RTV DIE BOND
ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
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MPX2010 MPXV2010G SERIES
LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 5) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION
END POINT STRAIGHT LINE FIT
OFFSET 0 50 PRESSURE (% FULLSCALE) 100
Figure 4. Linearity Specification Comparison
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX
Part Number MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX MPXV2010GP MPXV2010DP Case Type 344 344C 344B 344E 344F 1369 1351
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking
ORDERING INFORMATION -- UNIBODY PACKAGE (MPX2010 SERIES)
MPX Series Device Type Basic Element Ported Elements Differential Differential, Dual Port Gauge Gauge, Axial Gauge, Axial PC Mount Options Case Type 344 344C 344B 344E 344F Order Number MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX Device Marking MPX2010D MPX2010DP MPX2010GP MPX2010D MPX2010D
ORDERING INFORMATION -- SMALL OUTLINE PACKAGE (MPXV2010G SERIES)
Device Type Ported Elements Options Gauge, Side Port, SMT Differential, Dual Port, SMT Case No. 1369 1351 MPX Series Order No. MPXV2010GP MPXV2010DP Packing Options Trays Trays Marking MPXV2010G MPXV2010G
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Motorola Sensor Device Data
MPX2010 MPXV2010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7
T
N K
A
8X
M
P
0.004 (0.1)
SEATING PLANE
DETAIL G C
CASE 1369-01 ISSUE O
Motorola Sensor Device Data
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MPX2010 MPXV2010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS--CONTINUED
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs -Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7
N
T
A
M
P
8X
0.004 (0.1)
SEATING PLANE
DETAIL G C
K
CASE 1351-01 ISSUE O
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Motorola Sensor Device Data
MPX2010 MPXV2010G SERIES UNIBODY PACKAGE DIMENSIONS
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00
C R M
1
B
-A- N
PIN 1
1 2 3 4
2
3
4
Z
L
-T- J
SEATING PLANE
G F
4 PL
F Y
D
0.136 (0.005)
M
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
DIM A B C D F G J L M N R Y Z
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE Z
SEATING PLANE
-T- R H N
PORT #1 POSITIVE PRESSURE (P1)
-A- U L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC
-Q-
B
PIN 1
12 34
K S F G D 4 PL 0.13 (0.005)
-P- 0.25 (0.010) J C
M
TQ
S
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344B-01 ISSUE B
Motorola Sensor Device Data
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MPX2010 MPXV2010G SERIES UNIBODY PACKAGE DIMENSIONS -- CONTINUED
V R
PORT #2 PORT #1
-A- U W H
PORT #2 VACUUM (P2)
L
PORT #1 POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38
N
-Q-
SEATING PLANE
B
SEATING PLANE PIN 1
1234
-P- -T- J C 0.13 (0.005)
M
K
S
-T-
0.25 (0.010)
M
TQ
S G D 4 PL
F
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B
PORT #1 POSITIVE PRESSURE (P1)
C
BACK SIDE VACUUM (P2)
A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93
-B-
V
43 21 PIN 1
K J R
SEATING PLANE
S G F D 4 PL 0.13 (0.005)
M
N
-T-
TB
M
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344E-01 ISSUE B
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Motorola Sensor Device Data
MPX2010 MPXV2010G SERIES UNIBODY PACKAGE DIMENSIONS -- CONTINUED
-T- C E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92
V
N R
PORT #1 POSITIVE PRESSURE (P1)
B
-P- 0.25 (0.010)
M
PIN 1
TQ
M
4
3
2
1
S K
J
F D 4 PL 0.13 (0.005)
G TP Q
STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT
M
S
S
CASE 344F-01 ISSUE B
Motorola Sensor Device Data
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MPX2010 MPXV2010G SERIES
NOTES
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Motorola Sensor Device Data
MPX2010 MPXV2010G SERIES
NOTES
Motorola Sensor Device Data
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MPX2010 MPXV2010G SERIES
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/
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Motorola Sensor Device Data
MPX2010/D

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